Adapter for card connector

ABSTRACT

An adapter has a transmitting board ( 100 ) used for a card bus connector and having a top layer ( 11 ) having an array of pads ( 125 ) disposed on a front portion thereof, a bottom layer ( 12 ), a number of rows of holes ( 13 ) extending through the top layer and the bottom layer and positioned parallel to the array of the pads of the top layer, and a number of circuits ( 121 ) formed on the top layer and connected the rows of holes to corresponding pads. The circuits have a first circuit ( 11   a ) and a second circuit ( 11   b ). The first circuit radiates outwardly from an outer portion of corresponding holes of an outer row ( 13   a ) of the holes and extends far away the second circuit.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is directed to an adapter a used in a card busconnector, and more particularly to a transmitting board having circuitsformed thereon.

2. Description of Prior Arts

Traditional transmitting board 200 as shown in FIGS. 4-8, comprises atop and a bottom layer 21, 24 for transmitting signals, a first medialground layer 22 and a second medial ground layer 23 mounted between thetop and the bottom layer 21, 24. The first medial ground layer 22coopers with the top layer 21 to thereby controlling impedance in anacceptable scope. Similarly, the second medial ground layer 23cooperates with the bottom layer 24 to thereby controlling impedance inan acceptable scope.

However, such a four-layer of the transmitting board 200 will beresulted in a high cost.

Hence, it is desirable to provide an improved transmitting board toovercome the aforementioned disadvantages.

SUMMARY OF THE INVENTION

An object of the present invention is to provide an adapter comprising atransmitting board having a number of improved circuits formed thereon.

To achieve the above object, A transmitting board used in a card busconnector comprises a top layer having an array of pads disposed on afront portion thereof, a bottom layer, a plurality of holes extendingthrough the top layer and the bottom layer and positioned in differentrows parallel to the array of the pads of the top layer, and a pluralityof circuits. The circuits are formed on the top layer and connectedcorresponding conductive holes in different rows to corresponding pads,and comprises at least one pair of circuit adapted for transmittingdifferential signals between the card bus connector and the expresscard, the least one pair of circuits having a section extending betweena periphery edge of the board and an outmost row of conductive holesopposite to the row of pads and extending far away from the neighboringcircuit

Advantages of the present invention are to provide a transmitting boardhaving a top layer and a bottom layer which are easily mounted togetherto save cost. The distance between the first and second row ofdifferential circuits of the top layer is wide enough to effectivelyreduce EMI.

Other objects, advantages and novel features of the invention willbecome more apparent from the following detailed description of thepresent embodiment when taken in conjunction with the accompanyingdrawings.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a cross-sectional view of a transmitting board of the presentinvention;

FIG. 2 is a perspective view of a top layer of the transmitting board;

FIG. 3 is a perspective view of a bottom layer of the transmittingboard;

FIG. 4 is a cross-sectional view of a transmitting board of a prior art;

FIG. 5 is a perspective view of a top layer of the transmitting board ofthe prior art;

FIG. 6 is a perspective view of a first medial layer of the transmittingboard of the prior art;

FIG. 7 is a perspective view of a second medial layer of thetransmitting board of the prior art; and

FIG. 8 is a perspective view of a bottom layer of the transmitting boardof the prior art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Reference will now be made to the drawing figures to describe thepresent invention in detail. Referring to FIG. 1, a transmitting board100 used in a card bus connector (not shown) comprises a top layer 11having an array of pads 115 disposed on a front portion thereof and abottom layer 12 for transmitting signals. The top layer 11 and thebottom layer 12 are punched together.

Referring FIGS. 1-3, the transmitting board 100 has a plurality of rowsof holes 13 extending through the top layer 11 and the bottom layer 12and positioned parallel to the array of the pads 115 of the top layer11. The rows of holes 13 are paralleled to each other and have an outerrow of holes 13 a, a second row of holes 13 b and a third row of holes13 c.

The transmitting board 100 has a plurality of circuits 10 formed on thetop layer 11 and connecting to the a second and a third rows of holes 13b, 13 c to the pads 115. The circuits 10 comprise a first circuit 11 a,a second circuit 11 b and a third circuit 11 c adjacent to each otherfor transmitting differential signals. The first circuit 11 a radiatesoutwardly from an outer portion of holes 116 of the outer row of holes13 a and extends far away from the second circuit 11 b.

The second circuit 11 b has a first horizontal portion 112 formedbetween the outer and the second rows of the holes 13 a, 13 b and asecond horizontal portion 113 positioned between the second and thethird rows of the holes 13 b, 13 c to extend far away from the thirdcircuit 11 c. A minimal distance between the first circuit 11 a and thesecond circuit 11 b is larger than a distance between the adjacent twoholes 130 c of each row of the holes 13 a, 13 b, 13 c. A minimaldistance between the second circuit 11 b and the third circuit 11 c islarger than a distance between the adjacent two holes of each row of theholes 13 a, 13 b, 13 c.

The bottom layer 12 comprises a plurality of second pads 125 disposed ona front portion thereof and a plurality of electrical traces 121 formedthereon for connecting the holes 13 to the second pads 125.

It is to be understood, however, that even though numerouscharacteristics and advantages of the present invention have been setforth in the foregoing description, together with details of thestructure and function of the invention, the disclosure is illustrativeonly, and changes may be made in detail, especially in matters of shape,size, and arrangement of parts within the principles of the invention tothe full extent indicated by the broad general meaning of the terms inwhich the appended claims are expressed.

1. An adapter used between a card bus connector and an express cardcomprising a circuit board, the circuit board comprising: a top layerhaving a front portion and an array of pads disposed on the frontportion; a bottom layer; a plurality rows of conductive holes extendingthrough the top layer and the bottom layer and positioned parallel tothe array of the pads of the top layer; a plurality of circuits formedon the top layer and connected corresponding conductive holes indifferent rows to corresponding pads, and comprising at least one pairof circuits adapted for transmitting differential signals between thecard bus connector and the express card, the least one pair of circuitshaving a section extending between a periphery edge of the board and anoutmost row of conductive holes opposite to the row of pads andextending far away from the neighboring circuit.
 2. The transmittingboard as claimed in claim 1, the bottom layer comprises a plurality ofsecond pads disposed on a front portion thereof.
 3. The transmittingboard as claimed in claim 2, the bottom layer comprises a plurality ofelectrical traces for connecting the conductive holes to the secondpads.
 4. The transmitting board as claimed in claim 1, the top layer andthe bottom layer are punched together.
 5. A transmitting boardcomprising: a body defining a longitudinal direction and a verticaldirection perpendicular to each other, and consisting of opposite upperand lower layers sandwiching a shielding layer therebetween in thevertical direction; a plurality of circuit pads forms on a bottom edgeregion of the upper layer; three rows of through holes arranged in thebody along said longitudinal direction, said three rows beingcategorized with an inner row, a middle row and an outer row wherein theinner row is closer to the circuit pads than said middle row and saidouter row, and the outer row is closer to the upper edge region of theupper layer than the middle row and the inner row; said circuit padsincluding first, second and third sets of differential pair padsarranged in sequence along said longitudinal direction, said first,second and third sets of differential pair pads connected to thecorresponding through holes in sequence along said longitudinaldirection in the outer row via first, second and third sets of circuitpaths arranged in sequence along said longitudinal direction; whereinthe first, second and third sets of differential pair pads and thecorresponding through holes in said outer row are essentially disposedin an oblique manner, and the first set of circuit path first extendbeyond said outer row in said vertical direction approaching the upperedge then connected to the corresponding through hole so as to increasethe spaced distance with the second set of circuit path.
 6. Thetransmitting board as claimed in claim 5, wherein the second set ofcircuit path defines a horizontal section between, in said verticaldirection, the inner row and the middle row, and said horizontal sectionis longer than any other horizontal section of the first and third setsof circuit paths between, in said vertical direction, the inner row andthe middle row.
 7. The transmitting board as claimed in claim 6, whereinthe horizontal section of the first set of circuit path between theinner row and the middle row in said vertical direction, is essentiallydimensionally equal to the horizontal section of the second set ofcircuit path between the inner row and the middle row in said verticaldirection
 8. The transmitting board as claimed in claim 5, wherein thethird set of circuit path defines a horizontal section between, in saidvertical direction, the inner row and the circuit pads, and saidhorizontal section is longer than any other horizontal section of thefirst and third sets of circuit paths between, in said verticaldirection, the inner row and the circuit pads.
 9. The transmitting boardas claimed in claim 8, wherein the first set of circuit path defines ahorizontal section between, in said vertical direction, the middle rowand the upper edge region, which is essentially dimensionally equal tothe horizontal section of the third set of circuit path between, in saidvertical direction, said inner row and the circuit pads.
 10. Thetransmitting board as claimed in claim 5, wherein the first set ofcircuit path defines a horizontal section between the middle row and theupper edge region.
 11. The transmitting board as claimed in claim 10,wherein the horizontal section of the first set of circuit path extendsessentially in alignment with the outer row in said longitudinaldirection.
 12. The transmitting board as claimed in claim 5, wherein thefirst set of circuit path defines a horizontal section located between,in said vertical direction, the middle row and the inner row, andanother horizontal section located between, in said vertical direction,the middle row and the upper edge region, the second set of circuit pathdefines a horizontal section located between, in said verticaldirection, the middle row and the inner row, and another horizontalsection located between, in said vertical direction, said middle row andthe outer row, and the third set of circuit path located between, insaid vertical direction, the inner row and the bottom edge region, andanother horizontal section located between, in said vertical direction,the inner row and the middle row.